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Heavy Copper 3oz Power PCB Board Back Drilling Drone ESC Motor Drive Board

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Heavy Copper 3oz Power PCB Board Back Drilling Drone ESC Motor Drive Board

Name: Heavy Copper 3oz Power PCB Board Back Drilling Drone ESC Motor Drive Board
Brand: XSW PCB
Price: 1 USD

China Heavy Copper 3oz Power PCB Board Back Drilling Drone ESC Motor Drive Board wholesale

Price : Negotiable

Layer Count : 4-Layer Heavy Copper

Supply Ability : 1 Million Square Feet per Month

Back Drilling Stub : < 0.2 mm

Packaging Details : Anti-static bag with desiccant, vacuum-packed, export-grade corrugated carton

Board Thickness : 1.6 mm (Customizable)

Thermal Vias : Copper-filled arrays

Place of Origin : China

Min Line Width / Spacing : 0.15 mm / 0.15 mm

Delivery Time : 8-15 Days

Solder Mask Color : Green

Surface Finish : HASL Lead-Free

Model Number : XSW-PWR3

Material : FR-4 High-Tg 170

MOQ : 1 Piece

Payment Terms : T/T, Western Union, PayPal

Brand Name : XSW PCB

Certification : UL, ISO9001

Outer / Inner Copper : 3 oz / 2 oz

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Heavy Copper 3oz Power PCB Board with Back Drilling for Drone ESC Motor Drive

This heavy copper power PCB is purpose-built for drone electronic speed controllers (ESC), motor drivers and battery management boards. Featuring 3 oz outer copper, 2 oz inner copper and depth-controlled back drilling, it delivers the high current carrying capability and low thermal resistance demanded by high-power UAV propulsion systems.

Key Specifications

Layer Count	4-Layer (heavy copper power stack-up)
Material	FR-4 High-Tg 170
Board Thickness	1.6 mm (Customizable 1.0-3.2 mm)
Outer / Inner Copper	3 oz / 2 oz (up to 6 oz on request)
Min Line Width / Spacing	0.15 mm / 0.15 mm
Back Drilling	Depth-controlled, stub length < 0.2 mm
Thermal Vias	Copper-filled thermal via arrays
Solder Mask	Green
Surface Finish	HASL Lead-Free

Production Technical Difficulties We Solve

1. Heavy Copper Plating Uniformity

3 oz copper is electroplated with consistent thickness across the whole panel, using optimized shield and current density to avoid over-plating and under-plating that cause uneven current paths.

2. Thick Copper Etching Control

Etching 3 oz copper demands tight side-etch control to protect fine features and minimize undercut, keeping trace width within tolerance for predictable current rating.

3. Depth-Controlled Back Drilling

Back drilling removes via stubs to a controlled depth (< 0.2 mm stub) with high positional accuracy, reducing signal reflection and preventing copper burrs inside the via barrels.

4. Thermal Management

Copper-filled thermal vias and heavy copper planes are combined to pull heat away from power MOSFETs, keeping ESC junction temperatures under control during aggressive throttle.

5. Solder Mask over High-Topography Copper

Uniform solder mask coating is achieved over the raised heavy copper surface, preventing mask skip, bubbles and exposed copper that lead to short risks during assembly.

Why It Performs Under Load

Application	Drone ESC, brushless motor driver, BMS and power distribution boards
Current Capability	Designed for high-current propulsion and power conversion circuits
Assembly Service	SMT assembly with high-mass soldering and selective solder available
Testing	Flying probe, thermal cycling, AOI and 100% electrical test

Share your current, thermal and Gerber requirements and our engineering team will confirm the stack-up and quotation within 24 hours.

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