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6 Layer HDI Multilayer PCB Fabrication 0.05mm Fine Line Drone Flight Controller Board

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Shenzhen Xunsiwei Circuit Co., Ltd.

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6 Layer HDI Multilayer PCB Fabrication 0.05mm Fine Line Drone Flight Controller Board

Name: 6 Layer HDI Multilayer PCB Fabrication 005mm Fine Line Drone Flight Controller Board
Brand: XSW PCB
Price: 1 USD

China 6 Layer HDI Multilayer PCB Fabrication 0.05mm Fine Line Drone Flight Controller Board wholesale

Material : FR-4 High-Tg 170

Solder Mask Color : Matte Black

Supply Ability : 1 Million Square Feet per Month

Impedance Control : +/-10%

Certification : UL, ISO9001

Delivery Time : 8-15 Days

Price : Negotiable

Min Laser Drill (Microvia) : 0.1 mm

Payment Terms : T/T, Western Union, PayPal

Layer Count : 6-Layer (1+4+1 HDI)

Surface Finish : ENIG

Brand Name : XSW PCB

Model Number : XSW-HDI6

Place of Origin : China

Outer / Inner Copper : 1 oz / 0.5 oz

Packaging Details : Anti-static bag with desiccant, vacuum-packed, export-grade corrugated carton

Board Thickness : 1.0 mm (Customizable)

Min Line Width / Spacing : 0.05 mm / 0.05 mm

MOQ : 1 Piece

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6 Layer HDI Multilayer PCB Fabrication with 0.05mm Fine Line for Drone Flight Controller

This 6-layer HDI multilayer PCB is engineered for drone flight controller and inertial navigation modules where dense routing, high-speed signal integrity and low board weight are mission critical. The board is built on high-Tg FR-4 with laser-drilled microvias, LDI fine-line imaging and controlled impedance, delivering a compact, high-reliability interconnect platform for UAV electronics.

Key Specifications

Layer Count	6-Layer (1+4+1 HDI stack-up)
Material	FR-4 High-Tg 170 (Optional: Rogers / high-frequency)
Board Thickness	1.0 mm (Customizable 0.6-2.0 mm)
Outer / Inner Copper	1 oz / 0.5 oz
Min Line Width / Spacing	0.05 mm / 0.05 mm
Min Laser Drill (Microvia)	0.1 mm
Impedance Control	±10% (single-ended & differential)
Solder Mask	Matte Black
Surface Finish	ENIG (Immersion Gold)

Production Technical Difficulties We Solve

1. Microvia Laser Drilling Control

Blind and buried vias are laser-drilled down to 0.1 mm with strict aspect-ratio control, preventing barrel cracking and ensuring reliable copper plating in the microvia walls.

2. Fine Line / Space Imaging (0.05 mm)

Laser Direct Imaging (LDI) is applied to resolve 0.05 mm traces, holding registration precision to avoid open circuits and copper shorts on densely populated routing areas.

3. Layer-to-Layer Registration

CCD target punching and x-ray alignment keep 6-layer registration within ±0.025 mm, eliminating layer offset that would otherwise ruin impedance and via connectivity.

4. Controlled Impedance for High-Speed Signals

Stack-up and trace geometry are simulated and verified to hold ±10% impedance, protecting signal integrity between the flight controller MCU, IMU and communication links.

5. Sequential Lamination Reliability

Multiple lamination cycles are executed without resin starvation or delamination, preserving dielectric thickness consistency across every HDI layer.

Why It Performs in Flight

Application	Drone flight controller, IMU, gimbal and navigation boards
Assembly Service	SMT / BGA / QFN / fine-pitch BGA assembly available
Prototype Lead Time	3-5 days for prototype, 8-15 days for mass production
Testing	Flying probe, impedance coupon, AOI and 100% electrical test

Send your Gerber files and stack-up requirements, and our engineering team will return a DFM review and quotation within 24 hours.

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